Imaging assembly, method and molding mold for fabricating same, camera module, and smart terminal

ABSTRACT

The present application provides an imaging assembly, a method and molding mold for fabricating same, a camera module, and a smart terminal. According to an aspect of the present application, the imaging assembly includes a photosensitive element and a molded encapsulation portion. The photosensitive element has a photosensitive area. The molded encapsulation portion is formed around the photosensitive area and is in contact with the photosensitive element. The molded encapsulation portion has an inclined inner side surface and a top surface higher than the photosensitive area. A height difference between the top surface of the molded encapsulation portion and the photosensitive area of the photosensitive element is less than or equal to 0.7 mm, and the inclined inner side surface and the top surface have different surface roughnesses.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of Chineseapplication No. 201710693245.0, filed on Aug. 14, 2017 in the StateIntellectual Property Office of China, the disclosure of which isincorporated herein in its entirety by reference.

TECHNICAL FIELD

The present application relates to the technical field of imagingassemblies and smart terminals.

BACKGROUND

The structure of a camera module fabricated using the conventional chiponboard (COB) process is formed by assembling a circuit board, aphotosensitive chip, a camera base, a motor drive, and a lens assembly,while other electronic components are disposed on the surface layer ofthe circuit board.

Currently, the proportion of the photosensitive area of existingphotosensitive chips is increasing, and the edge of the photosensitivearea is becoming closer to the side wall of the light window. Since theside wall of the light window is quite close to the photosensitive area,the intensity of external light reflected by the side wall of the lightwindow onto the photosensitive area becomes higher, which makes thestray light stronger, thereby affecting the imaging quality of thecamera module.

SUMMARY

The present application provides an imaging assembly, a method andmolding mold for fabricating the same, a camera module, and a smartterminal.

According to an aspect of the present application, there is provided animaging assembly, comprising: a photosensitive element, having aphotosensitive area; and a molded encapsulation portion, formed aroundthe photosensitive area and in contact with the photosensitive element,and the molded encapsulation portion has an inclined inner side surfaceand a top surface higher than the photosensitive area, wherein a heightdifference between the top surface of the molded encapsulation portionand the photosensitive area of the photosensitive element is less thanor equal to 0.7 mm, and the inclined inner side surface has a differentsurface roughness from the top surface.

According to an aspect of the present application, there is provided amethod for fabricating an imaging assembly, comprising: mounting aphotosensitive element on a circuit board of an imaging assembly to befabricated; attaching a flexible film to a lower portion of a moldingmold, wherein the flexible film has a non-smooth surface facing awayfrom the molding mold, the lower portion of the molding mold comprises apressure head and a module portion located around the pressure head, andthe pressure head has an inwardly inclined surface at an edge thereof;disposing the molding mold with the flexible film onto thephotosensitive element, so that a height difference between a bottomsurface of the module portion facing the photosensitive element and atop surface of the photosensitive element is less than or equal to 0.7mm; and molding a molded encapsulation portion around the photosensitiveelement, between the bottom surface of the module portion facing thephotosensitive element and the top surface of the photosensitiveelement, and surrounding the inwardly inclined surface at the edge ofthe pressure head, so that the inclined inner side surface formed on themolded encapsulation portion adjacent to the inwardly inclined surfacehas a non-smooth surface corresponding to the non-smooth surface of theflexible film attached on the inwardly inclined surface.

According to an aspect of the present application, there is provided amolding mold for fabricating an imaging assembly, comprising: a pressurehead, having an inwardly inclined surface at an edge thereof; and amodule portion, surrounding the pressure head, wherein an operationalheight difference between a bottom surface of the module portionadjacent to the pressure head and a bottom surface of the pressure headis less than or equal to 0.7 mm.

According to an aspect of the present application, there is provided acamera module, comprising the above-mentioned imaging assembly.

According to an aspect of the present application, there is provided asmart terminal, comprising the above-mentioned camera module.

According to an aspect of the present application, there is provided animaging assembly, comprising: a photosensitive element, having aphotosensitive area; a molded encapsulation portion, formed around thephotosensitive area and in contact with the photosensitive element, andthe molded encapsulation portion has an inclined inner side surface anda top surface higher than the photosensitive area; and a dampingstructure, located between the photosensitive element and the inclinedinner side surface, wherein a height difference between the top surfaceof the molded encapsulation portion and a top of the damping structureis less than or equal to 0.7 mm, and the inclined inner side surface andthe top surface of the molded encapsulation portion have differentsurface roughnesses.

According to an aspect of the present application, there is provided amethod for fabricating an imaging assembly, comprising: mounting aphotosensitive element on a circuit board of an imaging assembly to befabricated; attaching a damping structure to the photosensitive element;attaching a flexible film to a lower portion of a molding mold, whereinthe flexible film has a non-smooth surface facing away from the moldingmold, the lower portion of the molding mold comprises a pressure headand a module portion located around the pressure head, and the pressurehead has an inwardly inclined surface at an edge thereof; disposing themolding mold with the flexible film onto the damping structure, so thata height difference between a bottom surface of the module portionfacing the photosensitive element and a top of the damping structure isless than or equal to 0.7 mm; and molding a molded encapsulation portionaround the photosensitive element, between the bottom surface of themodule portion facing the photosensitive element and the top surface ofthe photosensitive element, and surrounding the inwardly inclinedsurface at the edge of the pressure head, so that the inclined innerside surface formed on the molded encapsulation portion adjacent to theinwardly inclined surface has a non-smooth surface corresponding to thenon-smooth surface of the flexible film attached on the inwardlyinclined surface.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments are shown in the accompanying drawings. Theembodiments and accompanying drawings disclosed herein are provided forthe purpose of description, and should not be construed as limiting.

FIG. 1 illustrates a method for fabricating an imaging assemblyaccording to an embodiment of the present application;

FIG. 2a is a schematic diagram of step S110 in FIG. 1;

FIG. 2b is a schematic diagram of step S120 in FIG. 1;

FIG. 2c is a schematic diagram of step S130 in FIG. 1;

FIG. 2d is a schematic diagram of step S140 in FIG. 1;

FIG. 3a illustrates the physical meaning of formula (1);

FIG. 3b illustrates a variant of FIG. 3 a;

FIG. 4 is a cross-sectional view of an imaging assembly according to anembodiment of the present application;

FIG. 5a illustrates the meanings of parameters in formula (2);

FIG. 5b illustrates a variant of FIG. 5 a;

FIG. 6 is a cross-sectional view of a molding mold for fabricating animaging assembly according to an embodiment of the present application;

FIG. 7a illustrates the meanings of parameters in formula (3);

FIG. 7b illustrates a variant of FIG. 7 a;

FIG. 8 illustrates a method for fabricating an imaging assemblyaccording to another embodiment of the present application;

FIG. 9 is a cross-sectional view of an imaging assembly according toanother embodiment of the present application;

FIG. 10 illustrates a case where the damping structure in FIG. 9 is afilter element; and

FIG. 11 illustrates a case where the damping structure in FIG. 9 is astepped adhesive and a filter element.

DETAILED DESCRIPTION OF EMBODIMENTS

To facilitate the understanding of the present application, variousaspects of the present application will be described in further detailwith reference to the accompanying drawings. It should be understoodthat these detailed descriptions merely describe exemplary embodimentsof the present application, and are not intended to limit the scope ofthe present application in any way. Throughout this specification, samereference numerals denote same parts. The term “and/or” includes any andall combinations of one or more of the associated listed items.

It should be noted that in this specification, the terms such as “first”and “second” are merely used for distinguishing one feature fromanother, and are not intended to impose any limitation on the features.Therefore, a first subject discussed below may also be referred to as asecond subject without departing from the teaching of the presentapplication.

In the accompanying drawings, for the convenience of illustration, thethicknesses, sizes, and shapes of objects are slightly exaggerated. Theaccompanying drawings are illustrative only and are not drawn strictlyto scale.

It will be further understood that the terms “comprises,” “comprising,”“having,” “includes,” and/or “including,” when used in thisspecification, specify the presence of stated features, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, steps, operations,elements, components, and/or groups thereof. In addition, Expressionssuch as “at least one of,” when preceding a list of elements, modify theentire list of features, rather than individual elements in the list.Moreover, when the embodiments of the present application are described,the term “may” is used to indicate “one or more embodiments of thepresent application”. Furthermore, the term “exemplary” is used to referto illustrative description or description by way of example.

As used herein, the terms “substantially”, “about”, and similar termsare used as terms of approximation and not as terms of degree, and areintended to account for the inherent deviations in measured orcalculated values that would be recognized by those of ordinary skill inthe art.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by thoseof ordinary skill in the art to which the present application belongs.It will be further understood that terms, such as those defined incommonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand will not be interpreted in an idealized or overly formal senseunless expressly so defined herein.

Orientational terms mentioned in the present application, such as up,down, left, right, front, and rear, are used to refer to the relativepositions in the accompanying drawings for the convenience ofdescription, and are not intended to limit the present application. Inpractice, the actual orientations of the parts shown in the accompanyingdrawings can be adjusted as required.

In the following descriptions, only parts related to improvements in thepresent application are correspondingly described, and many existingparts such as connection wires like gold wires and other commonly-seencomponents in the imaging assembly are omitted.

It should also be noted that the features in different embodiments ofthe present application may be combined with each other on anon-conflict basis, and the order of the steps in the method may bechanged or the steps may take place concurrently. The presentapplication will be described below in detail with reference to theaccompanying drawings and in combination with the embodiments.

FIG. 1 illustrates a method for fabricating an imaging assemblyaccording to an embodiment of the present application. As shown in FIG.1, the method 100 includes steps S110 to S140.

In the step S110, a photosensitive element is mounted on a circuit boardof an imaging assembly to be fabricated. FIG. 2a is a schematic diagramof the step S110. As shown in FIG. 2a , in the step S110, aphotosensitive element 220 is mounted on a circuit board 210. Thecircuit board 210 is a part of a imaging assembly to be fabricated, andincludes thereon circuits needed by the imaging assembly. Thephotosensitive element 220 is a sensor in the imaging assembly to befabricated that is capable of sensing optical image information andconverting it into a usable output signal.

Referring to FIG. 1, in the step S120, a flexible film is attached to alower portion of a molding mold. FIG. 2b is a schematic diagram of thestep S120. As shown in FIG. 2b , in the step S120, a flexible film 300is attached to a lower portion of a molding mold 400 for fabricating animaging assembly. A surface 310 of the flexible film 300 facing awayfrom the molding mold 400 (that is, a surface substantially facingdownwards) is a non-smooth surface. The lower portion of the moldingmold 400 includes a pressure head 410 and a module portion 420. Themodule portion 420 is located around the pressure head 410, and thepressure head 410 has an inwardly inclined surface 411 at an edgethereof. Because the film 300 is flexible, when the flexible film 300 isattached to the lower portion of the molding mold 400, the part of theflexible film 300 attached to the pressure head 410 (shown by a dashedline in FIG. 2b ) will be stretched to deform. Because the surface 310of the flexible film 300 facing away from the molding mold 400 is anon-smooth surface, the part of the flexible film 300 attached to thepressure head 410 will cause its Ra (an arithmetic mean deviation of asurface roughness profile) to decrease due to being stretched that is,the surface roughness decreases.

Referring to FIG. 1, in the step S130, the molding mold to which theflexible film is attached is disposed onto the photosensitive element,so that a height difference between a bottom surface of the moduleportion facing the photosensitive element and a top surface of thephotosensitive element is less than or equal to 0.7 mm. FIG. 2c is aschematic diagram of the step S130. As shown in FIG. 2c , in the stepS130, the molding mold 400 with the flexible film 300 is disposed ontothe photosensitive element 220, so that a height difference 5H between abottom surface 421 of the module portion 420 and a top surface 221 ofthe photosensitive element 220 is less than or equal to 0.7 mm. In thepresent application, the value of δH can be adjusted by adjusting theheight difference between the bottom surface 412 of the pressure head410 and the bottom surface 421 of the module portion 420 (at the designstage of the molding mold 400 or at the fabrication stage of the imagingassembly). Because the height difference between the bottom surface 412and bottom surface 421 is adjusted during design or fabrication so thatδH is less than or equal to 0.7 m, the flexible film 300 is stretchedonly to a small extent, so that the surface roughness of the surface 310of the flexible film 300 only decreases slightly.

Referring to FIG. 1, in the step S140, a molded encapsulation portion ismolded around the photosensitive element, between the bottom surface ofthe module portion facing the photosensitive element and the top surfaceof the photosensitive element, and surrounding the inwardly inclinedsurface at the edge of the pressure head, so that inclined inner sidesurface formed on the molded encapsulation portion adjacent to theinwardly inclined surface has a non-smooth surface corresponding to thenon-smooth surface of the flexible film attached on the inwardlyinclined surface. FIG. 2d is a schematic diagram of the step S140. Asshown in FIG. 2d , in the step S140, to prepare the imaging assembly,molding is performed around the photosensitive element 220 and betweenthe bottom surface 421 of the module portion 420 facing thephotosensitive element 220 and the top surface 221 of the photosensitiveelement 220 (for example, by using a material such as a thermosettingresin), so as to form a molded encapsulation portion 230 surrounding theinwardly inclined surface 411. In this way, because the flexible film300 is attached on the lower portion of the molding mold 400 and thesurface 310 of the flexible film 300 that substantially faces downwardsis a non-smooth surface, inclined inner side surface 231 formed on themolded encapsulation portion 230 adjacent to the inwardly inclinedsurface 411 has a non-smooth surface corresponding to the non-smoothsurface 310 of the flexible film 300 attached on the inwardly inclinedsurface 411.

After the step S140, routine procedures such as demolding may further beperformed to obtain the imaging assembly.

In this way, because the height difference between the bottom surface ofthe module portion facing the photosensitive element and the top surfaceof the photosensitive element is controlled to be less than or equal to0.7 mm during the fabrication of the imaging assembly, the flexible filmis stretched only to a small extent during fabrication, so that thesurface roughness of the lower surface of the flexible film onlydecreases slightly. Therefore, the inclined inner side surface of themolded encapsulation portion in the fabricated imaging assembly also hasa desirable surface roughness to inhibit the reflection of light by theinclined inner side surface onto the photosensitive area of thephotosensitive element, thereby effectively controlling the impact ofstray light on the photosensitive element.

According to an embodiment of the present application, referring to FIG.2d , a reflectance of the inclined inner side surface 231 of the moldedencapsulation portion 230 to visible light is less than or equal to 5%.As described above, because of the improvement of the fabricationprocess, the inclined inner side surface of the molded encapsulationportion has a desirable surface roughness. Therefore, the reflectance ofthe inclined inner side surface decreases to a low level, so that thereflection of light by the inclined inner side surface is reduced.

According to an embodiment of the present application, the value of Ra(an arithmetic mean deviation of a surface roughness profile) of theinclined inner side surface 231 of the molded encapsulation portion 230is greater than or equal to 1 μm.

According to an embodiment of the present application, the Ra value ofthe non-smooth surface of the flexible film 300 attached on the moduleportion 420 is greater than the Ra value of the non-smooth surface ofthe flexible film 300 attached on the inwardly inclined surface 411. Asdescribed above, during the fabrication of the imaging assembly, thepart of the flexible film 300 attached on the pressure head 410 will bedeformed, while the part of the flexible film 300 attached on the moduleportion 420 will not or hardly be deformed. Therefore, the Ra value ofthe non-smooth surface of the flexible film 300 attached on the moduleportion 420 is greater than the Ra value of the non-smooth surface ofthe flexible film 300 attached on the inwardly inclined surface 411.

According to an embodiment of the present application, the step S130includes: pressing the pressure head with the flexible film directlyagainst the photosensitive area of the photosensitive element. Becausethe molded encapsulation portion of the imaging assembly will be formedaround the photosensitive area of the photosensitive element, and themolding material needs to be prevented from flowing onto thephotosensitive area during molding, the pressure head with the flexiblefilm can be pressed directly against the photosensitive area of thephotosensitive element. Because the flexible film is elastic due to itsflexibility, pressing the pressure head against the photosensitive areacan provide a good barrier to prevent the molding material from enteringthe photosensitive area.

According to an embodiment of the present application, an angle ofinclination of the inwardly inclined surface 411 with respect to thephotosensitive area of the photosensitive element is between 20 and 70degrees.

According to an embodiment of the present application, a stretchingcoefficient K is used to represent the degree to which the flexible filmis stretched during the fabrication of the imaging assembly. A larger Kindicates a higher degree to which the flexible film is stretched. K isrepresented by the following formula:

K=1+2d(1/sin α−1/tan α)/(b ₁+2b ₂)  (1)

where d represents a height difference between the bottom surface of themodule portion facing the photosensitive element and the top surface ofthe photosensitive element, a represents an angle of inclination of theinwardly inclined surface with respect to the top surface of thephotosensitive element, b₁ represents a distance between the inwardlyinclined surfaces of the pressure head, and b₂ represents a length of anorthographic projection of the inwardly inclined surface on the topsurface of the photosensitive element.

FIG. 3a illustrates the physical meaning of the above-mentioned formula(1). As shown in FIG. 3a , A1 represents a length of the part of theflexible film attached on the pressure head before being stretched. A2(not shown) is used to represent a length of the part attached on thepressure head after being stretched. It can be seen that A1=b₁+2b₂, andA2=b₁+2c. In this implementation, the stretching coefficient K of theflexible film is defined as K=A2/A1=(b₁+2c)/(b₁+2b₂). Theabove-mentioned formula (1) can be obtained by deduction.

According to the foregoing description, d (that is, δH) 0.7 mm,20°≤α≤70°. Limited by design and/or process conditions, b₁+2b₂≥2.48 mm.Therefore, according to this implementation, the stretching coefficientK of the flexible film is less than or equal to 1.4.

Because the value of K represents the degree to which the flexible filmis stretched during the fabrication of the imaging assembly, controllingthe value of K to be within a certain range can prevent an excessivedecrease in surface roughness of the flexible film due to unduestretching. In this way, it is ensured that the inclined inner sidesurface of the molded encapsulation portion in the fabricated imagingassembly also has a desirable surface roughness to inhibit thereflection of light by the inclined inner side surface onto thephotosensitive area of the photosensitive element, thereby effectivelycontrolling the impact of stray light on the photosensitive element.

FIG. 3b illustrates a variant of FIG. 3a . According to theimplementation shown in FIG. 3b , K may be represented by the followingformula:

K=1+(d ₁(1/sin α₁−1/tan α₁)+d ₂(1/sin α₂−1/tan α₂))/(b ₁ +b ₂ +b₃)  (1′)

As shown in FIG. 3b , d₁ and d₂ represent height differences between thebottom surface of the module portion facing the photosensitive elementand the top surface of the photosensitive element, α₁ and α₂ representangles of inclination of the inwardly inclined surface with respect tothe top surface of the photosensitive element, b₁ represents a distancebetween the inwardly inclined surfaces of the pressure head, and b₂ andb₃ represent lengths of orthographic projections of the inwardlyinclined surface on the top surface of the photosensitive element.

The difference between the implementations shown in FIG. 3b and FIG. 3alies in that the implementation shown in FIG. 3a is a case of theimplementation shown in FIG. 3b when d₁=d₂, α₁=α₂, and b₂=b₃.

According to an embodiment of the present application, the flexible filmhas an anti-adhesive surface facing toward the molding mold, tofacilitate the separation of the molding mold from the imaging assemblyduring the demolding operation after molding.

According to an embodiment of the present application, the flexible filmis made of one or more materials selected from group consisting of ETFE,PTFE, PFA, FEP, and PS. All of such materials can form an anti-adhesivesurface, and have such characteristics as good resistance to staining,high toughness, ease of separation, and high-temperature resistance,thereby facilitating the operation of the flexible film.

FIG. 4 is a cross-sectional view of an imaging assembly according to anembodiment of the present application. An imaging assembly 200 shown inFIG. 4 can be prepared by using the above-mentioned method 100. As shownin FIG. 4, the imaging assembly 200 may include a circuit board 210, aphotosensitive element 220, and a molded encapsulation portion 230. Thephotosensitive element 220 may have a photosensitive area 222. Themolded encapsulation portion 230 is formed around the photosensitivearea 222 and is in contact with the photosensitive element 220. Themolded encapsulation portion 230 has an inclined inner side surface 231and a top surface 232 higher than the photosensitive area 222. A heightdifference δH between the top surface 232 of the molded encapsulationportion 230 and the photosensitive area 222 of the photosensitiveelement 220 is less than or equal to 0.7 mm, and the inclined inner sidesurface 231 and the top surface 232 have different surface roughnesses.

Because the height difference between the bottom surface of the moduleportion facing the photosensitive element and the top surface of thephotosensitive element is controlled to be less than or equal to 0.7 mmduring the fabrication of the imaging assembly, the height differencebetween the top surface of the molded encapsulation portion and thephotosensitive area of the photosensitive element is less than or equalto 0.7 mm (in the present application, the influence of the thickness ofthe flexible film on the sizes of other elements can be ignored). Theflexible film is stretched only to a small extent during molding, sothat the surface roughness of the lower surface of the flexible filmonly decreases slightly. Accordingly, the inclined inner side surface ofthe molded encapsulation portion in the fabricated imaging assembly hasa desirable surface roughness. Although the inclined inner side surfaceand the top surface of the molded encapsulation portion have differentsurface roughnesses (and therefore have different reflectances), theinclined inner side surface still has a desirable surface roughness, andtherefore the reflection of light by the inclined inner side surfaceonto the photosensitive area of the photosensitive element can beinhibited, thereby the impact of stray light on the photosensitiveelement is effectively controlled.

According to an embodiment of the present application, a reflectance ofthe inclined inner side surface 231 of the molded encapsulation portion230 to visible light is less than or equal to 5%.

According to an embodiment of the present application, the value of Raof the inclined inner side surface 231 of the molded encapsulationportion 230 is greater than or equal to 1 μm.

According to an embodiment of the present application, the Ra value ofthe top surface 232 of the molded encapsulation portion 230 is greaterthan the Ra value of the inclined inner side surface 231.

According to an embodiment of the present application, an angle ofinclination of the inclined inner side surface 231 with respect to thephotosensitive area 222 is between 20 and 70 degrees.

According to an embodiment of the present application, the moldedencapsulation portion 230 has a size that satisfies the following inequation:

5d(1/sin α−1/tan α)≤(b ₁+2b ₂)  (2)

FIG. 5a illustrates the meanings of parameters in the above-mentionedformula (2). In the formulas (2) and (1), same signs are used toindicate same or similar parameters. As shown in FIG. 5a , d representsa height difference between the top surface of the molded encapsulationportion and the photosensitive area of the photosensitive element, arepresents an angle of inclination of the inclined inner side surfacewith respect to the photosensitive area, b₁ represents a distancebetween the opposite inclined inner side surfaces on the photosensitivearea, and b₂ represents a length of an orthographic projection of theinclined inner side surface on a plane encompassing the photosensitivearea.

It can be known from the above description of the formula (1) that1+2d(1/sin α−1/tan α)/(b₁+2b₂)≤1.4, Therefore, the formula (2) can beobtained by deduction.

FIG. 5b illustrates a variant of FIG. 5a . According to theimplementation shown in FIG. 5b , the molded encapsulation portion 230has a size that satisfies the following in equation:

d ₁(1/sin α₁−1/tan α₁)+d ₂(1/sin α₂−1/tan α₂)≤0.4(b ₁ +b ₂ +b ₃)  (2′)

As shown in FIG. 5b , d₁ and d₂ represent height differences between thetop surface of the molded encapsulation portion and the photosensitivearea of the photosensitive element, α₁ and α₂ represent angles ofinclination of the inclined inner side surface with respect to thephotosensitive area, b₁ represents a distance between the oppositeinclined inner side surfaces on the photosensitive area, and b₂ and b₃represent lengths of orthographic projections of the inclined inner sidesurface on a plane encompassing the photosensitive area.

The difference between the implementations shown in FIG. 5b and FIG. 5alies in that the implementation shown in FIG. 5a is a case of theimplementation shown in FIG. 5b when d₁=d₂, α₁=α₂, and b₂=b₃.

FIG. 6 is a cross-sectional view of a molding mold for fabricating animaging assembly according to an embodiment of the present application.The molding mold can be used in the method 100 shown in FIG. 1. As shownin FIG. 6, the molding mold 400 may include a pressure head 410 and amodule portion 420. The pressure head 410 has an inwardly inclinedsurface 411 at an edge thereof, and the module portion 420 surrounds thepressure head 410. An operational height difference between a bottomsurface 421 of the module portion 420 adjacent to the pressure head 410and a bottom surface 412 of the pressure head 410 is less than or equalto 0.7 mm.

In this way, when the imaging assembly is fabricated using theabove-mentioned molding mold, because the operational height differencebetween the bottom surface 421 of the module portion 420 adjacent to thepressure head 410 and the bottom surface 412 of the pressure head 410 isless than or equal to 0.7 mm, the flexible film, when being attached tothe molding mold, is stretched only to a small extent, so that thesurface roughness of the lower surface of the flexible film onlydecreases slightly. Therefore, the inclined inner side surface of themolded encapsulation portion in the fabricated imaging assembly also hasa desirable surface roughness to inhibit the reflection of light by theinclined inner side surface onto the photosensitive area of thephotosensitive element, thereby effectively controlling the impact ofstray light on the photosensitive element.

According to an embodiment of the present application, an angle ofinclination of the inwardly inclined surface 411 with respect to thebottom surface 412 of the pressure head 410 is between 20 and 70degrees.

According to an embodiment of the present application, the molding mold400 has a size that satisfies the following in equation:

5d(1/sin α−1/tan α)≤(b ₁+2b ₂)  (3)

FIG. 7a illustrates the meanings of parameters in the above-mentionedformula (3). In the formulas (3) and (1), same signs are used toindicate same or similar parameters. As shown in FIG. 7a , d representsan operational height difference between the bottom surface of themodule portion adjacent to the pressure head and the bottom surface ofthe pressure head, a represents an angle of inclination of the inwardlyinclined surface with respect to the bottom surface of the pressurehead, b₁ represents a distance between the inwardly inclined surfaces ofthe pressure head, and b₂ represents a length of an orthographicprojection of the inwardly inclined surface on a plane encompassing thebottom surface of the pressure head.

It can be known from the above description of the formula (1) that1+2d(1/sin α−1/tan α)/(b₁+2b₂)≤1.4, Therefore, the formula (3) can beobtained by deduction.

FIG. 7b illustrates a variant of FIG. 7a . According to theimplementation shown in FIG. 7b , the molding mold 400 has a size thatsatisfies the following in equation:

d ₁(1/sin α₁−1/tan α₁)+d ₂(1/sin α₂−1/tan α₂)≤0.4(b ₁ +b ₂ +b ₃)  (3′)

As shown in FIG. 7b , d₁ and d₂ represent operational height differencesbetween the bottom surface of the module portion adjacent to thepressure head and the bottom surface of the pressure head, α₁ and α₂represent angles of inclination of the inwardly inclined surface withrespect to the bottom surface of the pressure head, b₁ represents adistance between the inwardly inclined surfaces of the pressure head,and b₂ and b₃ represents lengths of orthographic projections of theinwardly inclined surface on a plane encompassing the bottom surface ofthe pressure head.

The difference between the implementations shown in FIG. 7b and FIG. 7alies in that the implementation shown in FIG. 7a is a case of theimplementation shown in FIG. 7b when d₁=d₂, α₁=α₂, and b₂=b₃.

According to an embodiment of the present application, a camera moduleis provided, which may include the above-mentioned imaging assembly.

According to another embodiment of the present application, a smartterminal is provided, which may include the above-mentioned cameramodule.

FIG. 8 illustrates a method for fabricating an imaging assemblyaccording to another embodiment of the present application. As shown inFIG. 8, the method 800 includes steps S810 to S850.

In the step S810, a photosensitive element is mounted on a circuit boardof an imaging assembly to be fabricated. This step is the same as orsimilar to the step S110, and will not be repeatedly described here.

In the step S820, a damping structure is attached to the photosensitiveelement. The damping structure can be used for protecting thephotosensitive element and/or components such as connection wires fromimpact.

In the step S830, a flexible film is attached to a lower portion of amolding mold. The flexible film has a non-smooth surface facing awayfrom the molding mold. The lower portion of the molding mold includes apressure head and a module portion located around the pressure head, andthe pressure head has an inwardly inclined surface at an edge thereof.This step is the same as or similar to the step S120, and will not berepeatedly described here.

In the step S840, the molding mold with the flexible film is disposedonto the photosensitive element, so that a height difference between abottom surface of the module portion facing the photosensitive elementand a top surface of the damping structure is less than or equal to 0.7mm. This step is similar to the step S130, and the difference lies inthat the damping structure is introduced in the step S820; therefore, inthe step S840, the molding mold with the flexible film needs to bedisposed on the damping structure, rather than on the photosensitiveelement, and the height difference between the bottom surface of themodule portion facing the photosensitive element and the top of thedamping structure is less than or equal to 0.7 mm.

In the step S850, a molded encapsulation portion is molded around thephotosensitive element, between the bottom surface of the module portionfacing the photosensitive element and the top surface of thephotosensitive element, and surrounding the inwardly inclined surface atthe edge of the pressure head, so that an inclined inner side surfaceformed on the molded encapsulation portion adjacent to the inwardlyinclined surface has a non-smooth surface corresponding to thenon-smooth surface of the flexible film attached on the inwardlyinclined surface. This step is the same as or similar to the step S140,and will not be repeatedly described here.

After the step S850, routine procedures such as demolding may further beperformed, thus obtaining the imaging assembly.

According to an embodiment of the present application, the dampingstructure is a stepped adhesive and/or a filter element.

According to an embodiment of the present application, a reflectance ofthe inclined inner side surface of the molded encapsulation portion tovisible light is less than or equal to 5%.

According to an embodiment of the present application, the value of Raof the inclined inner side surface of the molded encapsulation portionis greater than or equal to 1 μm.

According to an embodiment of the present application, the Ra value ofthe non-smooth surface of the flexible film attached on the moduleportion is greater than the Ra value of the non-smooth surface of theflexible film attached on the inwardly inclined surface.

According to an embodiment of the present application, disposing themolding mold with the flexible film onto the damping structure includes:pressing the pressure head with the flexible film directly against thedamping structure.

According to an embodiment of the present application, an angle ofinclination of the inwardly inclined surface with respect to thephotosensitive area is between 20 and 70 degrees.

According to an embodiment of the present application, after theflexible film is attached to the lower portion of the molding mold, aresulting stretching coefficient K of the flexible film is less than orequal to 1.4, where

K=1+2d(1/sin α−1/tan α)/(b ₁+2b ₂)  (4)

where d represents a height difference between the bottom surface of themodule portion facing the photosensitive element and the top of thedamping structure, a represents an angle of inclination of the inwardlyinclined surface with respect to the photosensitive area, b₁ representsa distance between the inwardly inclined surfaces of the pressure head,and b₂ represents a length of an orthographic projection of the inwardlyinclined surface on a plane encompassing the photosensitive area.

The difference between the above-mentioned formula (4) and formula (1)lies only in that in the formula (4), d represents the height differencebetween the bottom surface of the module portion facing thephotosensitive element and the top of the damping structure; while inthe formula (1), d represents the height difference between the bottomsurface of the module portion facing the photosensitive element and thetop surface of the photosensitive element.

According to an embodiment of the present application, after theflexible film is attached to the lower portion of the molding mold, aresulting stretching coefficient K of the flexible film is less than orequal to 1.4, where

K=1+(d ₁(1/sin α₁−1/tan α₁)+d ₂(1/sin α₂−1/tan α₂))/(b ₁ +b ₂ +b₃)  (4′)

where d₁ and d₂ represent height differences between the bottom surfaceof the module portion facing the photosensitive element and the top ofthe damping structure, α₁ and α₂ represent angles of inclination of theinwardly inclined surface with respect to the photosensitive area, b₁represents a distance between the inwardly inclined surfaces of thepressure head, and b₂ and b₃ represent lengths of orthographicprojections of the inwardly inclined surface on a plane encompassing thephotosensitive area.

The difference between the above-mentioned formula (4′) and formula (4)lies in that the implementation expressed by the formula (4) is a caseof the implementation expressed by the formula (4′) when d₁=d₂, α₁=α₂,and b₂=b₃.

According to an embodiment of the present application, the flexible filmhas an anti-adhesive surface facing toward the molding mold.

According to an embodiment of the present application, the flexible filmis made of one or more materials selected from group consisting of ETFE,PTFE, PFA, FEP, and PS.

FIG. 9 is a cross-sectional view of an imaging assembly according toanother embodiment of the present application. An imaging assembly 200′shown in FIG. 9 can be prepared by using the above-mentioned method 800.As shown in FIG. 9, the imaging assembly 200′ may include a circuitboard 210, a photosensitive element 220, a molded encapsulation portion230, and a damping structure 240. The photosensitive element 220 mayhave a photosensitive area 222. The molded encapsulation portion 230 isformed around the photosensitive area 222 and is in contact with thephotosensitive element 220. The molded encapsulation portion 230 has aninclined inner side surface 231 and a top surface 232 higher than thephotosensitive area 222. The damping structure 240 is located betweenthe photosensitive element 220 and the inclined inner side surface 231.A height difference δH′ between the top surface 232 of the moldedencapsulation portion 230 and a top 241 of the damping structure 240 isless than or equal to 0.7 mm, and the inclined inner side surface 231and the top surface 232 of the molded encapsulation portion 230 havedifferent surface roughnesses.

According to an embodiment of the present application, the dampingstructure is a stepped adhesive and/or a filter element. The dampingstructure shown in FIG. 9 is a stepped adhesive. FIG. 10 illustrates acase where the damping structure in FIG. 9 is a filter element. FIG. 11illustrates a case where the damping structure in FIG. 9 is a steppedadhesive and a filter element.

According to an embodiment of the present application, a reflectance ofthe inclined inner side surface of the molded encapsulation portion tovisible light is less than or equal to 5%.

According to an embodiment of the present application, the Ra value ofthe inclined inner side surface of the molded encapsulation portion isgreater than or equal to 1 μm.

According to an embodiment of the present application, the Ra value ofthe top surface of the molded encapsulation portion is greater than theRa value of the inclined inner side surface.

According to an embodiment of the present application, an angle ofinclination of the inclined inner side surface with respect to thephotosensitive area is between 20 and 70 degrees.

According to an embodiment of the present application, the moldedencapsulation portion has a size that satisfies the following inequation:

5d(1/sin α−1/tan α)≤(b ₁+2b ₂)  (5)

where d represents a height difference between the top surface of themolded encapsulation portion and the top of the damping structure, arepresents an angle of inclination of the inclined inner side surfacewith respect to the photosensitive area, b₁ represents a distancebetween the opposite inclined inner side surfaces on the dampingstructure, and b₂ represents a length of an orthographic projection ofthe inclined inner side surface on a plane encompassing thephotosensitive area.

The difference between the above-mentioned formula (5) and formula (2)lies only in that in the formula (5), d represents the height differencebetween the top surface of the molded encapsulation portion and the topof the damping structure, and b₁ represents the distance between theopposite inclined inner side surfaces on the damping structure; while inthe formula (2), d represents the height difference between the topsurface of the molded encapsulation portion and the photosensitive areaof the photosensitive element, and b₁ represents the distance betweenthe opposite inclined inner side surfaces on the photosensitive area.

According to an embodiment of the present application, the moldedencapsulation portion has a size that satisfies the following inequation:

d ₁(1/sin α₁−1/tan α₁)+d ₂(1/sin α₂−1/tan α₂)≤0.4(b ₁ +b ₂ +b ₃)  (5′)

where d₁ and d₂ represent height differences between the top surface ofthe molded encapsulation portion and the top of the damping structure,α₁ and α₂ represent angles of inclination of the inclined inner sidesurface with respect to the photosensitive area, b₁ represents adistance between the opposite inclined inner side surfaces on thedamping structure, and b₂ and b₃ represent lengths of orthographicprojections of the inclined inner side surface on a plane encompassingthe photosensitive area.

The difference between the above-mentioned formula (5′) and formula (5)lies in that the implementation expressed by the formula (5) is a caseof the implementation expressed by the formula (5′) when d₁=d₂, α₁=α₂,and b₂=b₃.

Although the foregoing descriptions include many specific configurationsand parameters, it should be noted that these specific configurationsand parameters are merely used for describing an embodiment of thepresent application and should not be construed as limiting the scope ofthe present application. It should be understood by those skilled in theart that various modifications, additions, and replacements may be madewithout departing from the scope and spirit of the present application.The scope of the present application shall be subject to the appendedclaims.

What is claimed is:
 1. An imaging assembly, comprising: a photosensitiveelement having a photosensitive area; a molded encapsulation portionformed around the photosensitive area and in contact with thephotosensitive element, and the molded encapsulation portion has aninclined inner side surface and a top surface higher than thephotosensitive area; and a damping structure located between thephotosensitive element and the inclined inner side surface, wherein aheight difference between the top surface of the molded encapsulationportion and a top of the damping structure is less than or equal to 0.7mm, and the inclined inner side surface and the top surface of themolded encapsulation portion have different surface roughnesses.
 2. Theimaging assembly according to claim 1, wherein the damping structure isa stepped adhesive and/or a filter element.
 3. The imaging assemblyaccording to claim 1, wherein a reflectance of the inclined inner sidesurface of the molded encapsulation portion to visible light is lessthan or equal to 5%.
 4. The imaging assembly according to claim 1,wherein an arithmetic mean deviation of a surface roughness profile ofthe inclined inner side surface of the molded encapsulation portion isgreater than or equal to 1 μm.
 5. The imaging assembly according toclaim 1, wherein an arithmetic mean deviation of a surface roughnessprofile of the top surface of the molded encapsulation portion isgreater than an arithmetic mean deviation of a surface roughness profileof the inclined inner side surface.
 6. The imaging assembly according toclaim 1, wherein an angle of inclination of the inclined inner sidesurface with respect to the photosensitive area is between 20 and 70degrees.
 7. The imaging assembly according to claim 1, wherein themolded encapsulation portion has a size that satisfies the following inequation:5d(1/sin α−1/tan α)≤(b ₁+2b ₂), wherein, d represents a heightdifference between the top surface of the molded encapsulation portionand the top of the damping structure, a represents an angle ofinclination of the inclined inner side surface with respect to thephotosensitive area, b₁ represents a distance between the oppositeinclined inner side surfaces on the damping structure, and b₂ representsa length of an orthographic projection of the inclined inner sidesurface on a plane encompassing the photosensitive area.
 8. The imagingassembly according to claim 1, wherein the molded encapsulation portionhas a size that satisfies the following in equation:d ₁(1/sin α₁−1/tan α₁)+d ₂(1/sin α₂−1/tan α₂)≤0.4(b ₁ +b ₂ +b ₃),wherein, d₁ and d₂ represent height differences between the top surfaceof the molded encapsulation portion and the top of the dampingstructure, α₁ and α₂ represent angles of inclination of the inclinedinner side surface with respect to the photosensitive area, b₁represents a distance between the opposite inclined inner side surfaceson the damping structure, and b₂ and b₃ represent lengths oforthographic projections of the inclined inner side surface on a planeencompassing the photosensitive area.
 9. A method for fabricating animaging assembly, comprising: mounting a photosensitive element on acircuit board of an imaging assembly to be fabricated; attaching adamping structure to the photosensitive element; attaching a flexiblefilm to a lower portion of a molding mold, wherein the flexible film hasa non-smooth surface facing away from the molding mold, the lowerportion of the molding mold comprises a pressure head and a moduleportion located around the pressure head, and the pressure head has aninwardly inclined surface at an edge of the pressure head; disposing themolding mold with the flexible film onto the damping structure, so thata height difference between a bottom surface of the module portionfacing the photosensitive element and a top of the damping structure isless than or equal to 0.7 mm; and molding a molded encapsulation portionaround the photosensitive element, between the bottom surface of themodule portion facing the photosensitive element and the top surface ofthe photosensitive element, and surrounding the inwardly inclinedsurface at the edge of the pressure head, so that an inclined inner sidesurface formed on the molded encapsulation portion adjacent to theinwardly inclined surface has a non-smooth surface corresponding to thenon-smooth surface of the flexible film attached on the inwardlyinclined surface.
 10. The method according to claim 9, wherein thedamping structure is a stepped adhesive and/or a filter element.
 11. Themethod according to claim 9, wherein a reflectance of the inclined innerside surface of the molded encapsulation portion to visible light isless than or equal to 5%.
 12. The method according to claim 9, whereinan arithmetic mean deviation of a surface roughness profile of theinclined inner side surface of the molded encapsulation portion isgreater than or equal to 1 μm.
 13. The method according to claim 9,wherein an arithmetic mean deviation of a surface roughness profile ofthe non-smooth surface of the flexible film attached on the moduleportion is greater than an arithmetic mean deviation of a surfaceroughness profile of the non-smooth surface of the flexible filmattached on the inwardly inclined surface.
 14. The method according toclaim 9, wherein the disposing the molding mold with the flexible filmonto the damping structure comprises: pressing the pressure head withthe flexible film directly against the damping structure.
 15. The methodaccording to claim 9, wherein an angle of inclination of the inwardlyinclined surface with respect to the photosensitive area is between 20and 70 degrees.
 16. The method according to claim 9, wherein after theflexible film is attached to the lower portion of the molding mold, aresulting stretching coefficient K of the flexible film is less than orequal to 1.4, whereinK=1+2d(1/sin α−1/tan α)/(b ₁+2b ₂), wherein, d represents a heightdifference between the bottom surface of the module portion facing thephotosensitive element and the top of the damping structure, αrepresents an angle of inclination of the inwardly inclined surface withrespect to the photosensitive area, b₁ represents a distance between theinwardly inclined surfaces of the pressure head, and b₂ represents alength of an orthographic projection of the inwardly inclined surface ona plane encompassing the photosensitive area.
 17. The method accordingto claim 9, wherein after the flexible film is attached to the lowerportion of the molding mold, a resulting stretching coefficient K of theflexible film is less than or equal to 1.4, whereinK=1+(d ₁(1/sin α₁−1/tan α₁)+d ₂(1/sin α₂−1/tan α₂))/(b ₁ +b ₂ +b ₃),wherein, d₁ and d₂ represent height differences between the bottomsurface of the module portion facing the photosensitive element and thetop of the damping structure, α₁ and α₂ represent angles of inclinationof the inwardly inclined surface with respect to the photosensitivearea, b₁ represents a distance between the inwardly inclined surfaces ofthe pressure head, and b₂ and b₃ represent lengths of orthographicprojections of the inwardly inclined surface on a plane encompassing thephotosensitive area.
 18. The method according to claim 9, wherein theflexible film has an anti-adhesive surface facing toward the moldingmold.
 19. The method according to claim 9, wherein the flexible film ismade of one or more materials selected from group consisting of ETFE,PTFE, PFA, FEP, and PS.